PD IEC PAS 62240:2001 pdf download PRE-STANDARD — Use of semiconductor devices outside manufacturer’s specified temperature ranges
2.2Informative References
EC PAS，Electronic Component Management Plans.IEC 60134, Rating Systems for Electronic Tubes and Valves and Analogous SemiconductorDevices (lst Edition,1961).
3Terms and Definitions
Note: The terms uprafing and thermal uprating are being used increasingly in avionics industry discussions andmeetings, and clear definitions are included in this clause. They were coined as shorthand references to a speciacase of methods commonly used in selecting components for circuit design. This document describes the methodsand processes for implementing this special case. Al of the elements of these processes employ existing.commonly used engineering practices. No new or unique engineering knowledge is required to follow theseprocesses: only a rigorous application of the overall approach.
The following terms and definitions are used herein and/or should be used when using devicesoutside the manufacturers’ specified temperature ranges
Absolute maximum ratings are limiting values of operating and environmental conditions applicableto any semiconductor device of a specific type as defined by its published data, which should not beexceeded under the worst possible conditions. These values are chosen by the device manufacturerto provide acceptable serviceability of the device, taking no responsibility for equipment variations.and the effects of changes in operating conditions due to variations in the characteristics of thedevice under consideration and all other electronic devices in the equipment.(From IEC 134, 1st
Edition 1961).Ambient temperature is the temperature of the environment in which a semiconductor device isoperating.
Case temperature is the temperature of the surface of a semiconductor device package duringoperation.
Circuit Element Functional Mode Analysis: A documented analysis that determines minimumsranges and maximums of all functional characteristics of the assembly with respect to the relatedunctional parameters of devices being uprated.
Device capability assessment is the process of demonstrating that the device design is capable ofproviding the specified functionality, over the wider temperature range, for the required length oftime. It assumes that the device has been qualified to operate within its specified temperature range.and includes additional testing or analysis to evaluate expected performance at the widertemperature range. Device capability assessment includes both performance and application-specific reliability.
Device quality assurance over the wider temperature range is the additional testing or analysisrequired to assure that each individual device is capable of operating successfully in the requiredwider temperature range.
ECMP are the initials for Electronic Component Management Plan.Semiconductor devices are electronic devices that are not subject to disassembly without destructionor impairment of design use. They are sometimes called electronic parts or piece parts. Examplesare diodes,integrated circuits, and transistors.
PD IEC PAS 62240:2001 pdf download
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