IEEE 1101.7-1995 pdf download IEEE Standaird for Space Applications Module, Extended Height Format E Form Factor
1. Overview
1.1 Scope
This standard establishes the design requirements for a module designaled for use in spacecraft, boosters,and other highly rugged, conductively cooled environments. Conformance to IEEE Std 1101.4-1993′ wasmaintained where applicable. The requirements herein serve to specify the mechanical design of the module.In the event of conflict between the text of this standard and the references cited herein, the text of this stan-dard shall take precedence. Nothing in this standard, however, supersedes applicable laws and regulationsunless a specific exemption has been obtained.
1.2 Purpose
The purpose of this standard is the specification of dimensions and tolerances that will ensure the mechanical intermateability of spaceborne modules within associated subracks. In addition, mechanical characteris-tics for spaceborne applications are included.
1.3 Mechanical characteristics
This standard provides dimensions and tolerances for modules, chassis, printed wiring boards (PWBs)backplanes, and other connecto-related dimensions that are specific to the use of 300-pin and 396-pin con-nectors (as described in 5.9). These dimensions and tolerances are designed to ensure mechanical functionand interoperability.
1.4 Environmental requirements
The module shall meet the environmental requirements of clause 6 of IEEE P896.10. The performance levelshall be specifed by the procurement activity. This standard is primarily intended for space applicationsusing all performance levels specified, but does not exclude other applications using other performancelevels.
2. References
This standard shall be used in conjunction with the following publications. When the following standards are superseded by an approved revision, the revision shall apply:
ANSI Y 14.5M-1982 (Reaff 1988), American National Standard for Dimensioning and Tolerancing2
ANSI/IPC D-275-1991, Design Standard for Rigid Printed Boards and Rigid Printed Board As~emblies.~
ASTM E595-1984, Standard Test Method for Total Mass Loss and Collected Volatile Condensible Materials from Outgassing in a Vacuum En~ironment.~
EIA Proposed IS-22, Miniaturized Two-Part Blade-Tuning Fork Connector for Printed Wiring Boards and Backplanes .5
IEEE P896.10, IEEE Draft Standard for Futurebus+ Spaceborne Systems, Profile S (D3.6Dec. 1994).6
IEEE Std 1101.4-1993, IEEE Standard for Military Module, Format E Form Factor (ANSI)?
IEEE Std 1156.1 -1993, IEEE Standard for Microcomputer Environmental Specifications for Computer Modules (ANSI).
MIL-HDBK-217E Reliability Prediction of Electronic Equipment.’
MIL,-I-46058C, Electrical Insulating Compound (For Coating Printing Circuit Assemblies).
MIL-P-50884C, Flexible and Rigid-Flex Printed Wiring.
MIL-P-55110E, General Specification for Printed Wiring Boards.
MIL-STD- 130G, Standard Identification Marking of United States Military Property.
MIL-STD-454N, Standard General Requirements for Electronic Equipment.
MIL-STD-889B, Standard for Dissimilar Meds.
MTL-STD- 1543B, Standard Reliability Program Requirements for Space and Launch Vehicles.
MIL-STD-2118, Flexible and Rigid-Flex Printed Wiring for Electronic Equipment Design.
MIL-STD-l547B, Electronic Parts, Materials and Processes for Space and Launch Vehicles.
IEEE 1101.7-1995 pdf download
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