IEC PAS 62293:2001 pdf download Qualification and performance specification for high density interconnect (HDI) layers or boards
1 SCOPE
This specification establishes the specific requirements for organic high-density interconnect (HDI) layers with microvia technology and the quality and reliability assur- ance requirements that must be met for their acquisition.
1 .1 Purpose
The requirements contained herein are intended to reflect the electrical, mechanical, and environ- mental properties unique to the HDI layer. It is NOT intended to specify overall requirements for the core, which are already documented in the sectional performance specifications: IPC-6012 (rigid), IPC-6013 (flex), IPC-6015 (MCM-L), or IPC-6018 (microwave).
1 .2 Performance Classification
This specification rec- ognizes HDI layers or boards will be subject to variations in performance requirements based on end use. The accep- tance criteria of HDI layers are organized into slash sheet categories (A, B, C, etc., see Appendix A), which reflect those typical end-use applications. Users of this document shall select a slash sheet category that most closely resembles their product and are encouraged to modify it as necessary.
1 .3 Slash Sheet Categories
A. Chip Carrier
B. Hand Held (cell phones, pagers)
C. High Performance (avionics, military, medical)
D. Harsh Environment (automotive, space)
E. Portable (laptops, PDAs)
1 .4 Documentation Hierarchy This document, com- bined with IPC-6011 and the applicable sectional perfor- mance specification(s) (IPC-6012, IPC-6013, IPC-6015 or IPC-6018), constitute a qualification and performance specification for HDI layers or boards.
2 APPLICABLE DOCUMENTS The following specifications of the revision in effect at the time of order form a part of this document to the extent specified herein. If a conflict of requirements exists between IPC-6016 and the listed applicable documents, IPC-6016 shall take precedence.
2.1 IPC 1 IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits IPC-PC-90 General Requirements for Implementation of
Statistical Process Control
IPC-FC-231 Flexible Base Dielectrics for Use in Flexible Printed Wiring
IPC-FC-232 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Binding Films
IPC-FC-241 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring
IPC-AI-642 User’s Guidelines for Automated Inspection of Artwork, Innerlayers, and Unpopulated PWBs
IPC-TM-650 Test Methods Manual 2
2.1.1 Microsectioning
2.1.1.2 Microsectioning—Semi or Automatic Technique Microsection Equipment (Alternate)
2.4.1 Adhesion, Tape Testing
2.4.8 Peel Strength of Metallic Clad Laminates
2.4.21.1 Bond Strength, Surface Mount Lands Perpendicular Pull Method
2.4.22 Bow and Twist
2.5.7 Dielectric Withstanding Voltage, PWB
2.6.3 Moisture and Insulation Resistance, Printed Boards
2.6.7.2 Thermal Shock, Continuity and Microsection,Printed Boards
2.6.8 Thermal Stress, Plated-Through Holes
2.6.8.1 Thermal Stress, Laminate
2.6.20 Assessment of Plastic Surface Mount Components for Susceptibility to Moisture/Reflow Induced Damage
IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Board Assemblies
IEC PAS 62293:2001 pdf download
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