IEC PAS 62169:2000 pdf download Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices
1 Foreword
The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concernsregarding package cracks and delamination. This document describes the standardized levels of floor lifeexposure for moisture/reflow-sensitive SMDs along with the handling, packing and shippingrequirements necessary to avoid moisture/reflow-related failures. Companion documents, J-STD-020define the classification procedure and JEP113 define the labeling requirements.
Moisture from atmospheric humidity will enter permeable packaging materials by diffusion andpreferentially collect at the dissimilar material interfaces. Assembly processes, used to solder SMDs toprinted circuit boards (PCBs), will expose the entire package body to temperatures higher than 200 °C.During solder reflow, the combination of rapid moisture expansion and materials mismatch can result inpackage cracking and/or delamination of critical interfaces within the package.
The solder reflow processes of concern are convection, convection/lR, infrared (R), vapor phase (VPR),and hot air rework tools. The use of assembly processes that immerse the component body in moltensolder are not recommended for most SMD components
2 Purpose
The purpose of this document is to provide SMD manufacturers and users with standardized methods forhandling, packing, shipping, and use of moisture/reflow sensitive SMDs. These methods are provided toavoid damage from moisture absorption and exposure to solder reflow temperatures that can result inyield and reliability degradation. By using these procedures, safe and damage-free reflow can beachieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags of12 months from the seal date.
3 Scope
3.1 Packages
3.1.1 This standard applies to all nonhermetic SMDs subjected to bulk solder reflow processes duringPCB assembly, including plastic encapsulated packages and all other packages made with moisture-permeable polymeric materials (epoxies, silicones, etc.) that are exposed to the ambient air.
3.1.2 Hermetic components are not at risk and do not require moisture precautionary handling Scope (cont’d)
3.2 Assembly processes
3.2.1 This standard applies to bulk solder reflow assembly by convection, convection/IR, infrared (IR),and vapor phase reflow (VPR) processes. It does not apply to bulk solder reflow processes that immersethe component bodies in molten solder (e.g., backside wave solder). Such processes are not allowed formany SMDs and are not covered by the component qualifications standards used as a basis for this
document.
3.2.2 This standard also applies to moisture sensitive components that are removed or attached singly bylocal ambient heating,i.e..“hot air rework.”
3.2.3 This standard does not apply to components that are socketed and not exposed to solder reflowtemperatures. Such components are not at risk and do not require moisture precautionary handling.
3.2.4 This standard does not apply to components in which only the leads are heated to reflow the solder.e.g., hand-soldering, hot bar attach of gull wing leads, and pin-thru-hole with backside wave solder. Theheat absorbed by the package body from such operations is typically much lower than for bulk surfacemount reflow or hot air rework, and moisture precautionary measures are typically not needed.
3.3 Reliability
3.3.1 The methods set forth in this specification ensure that adequate component reliability, as evaluatedand verified by J-STD-020 and/or by JESD22-A113 plus environmental reliability testing, is maintainedduring and after the PCB assembly operation.
3.3.2 This specification does not address or ensure solder joint reliability of attached components.
4Applicable documents
4.1 EIA JEDEC/Institute for Interconnecting and Packaging Electronic Circuits (IPC) & JointIndustry Standards
J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface MountDevices

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