IEC PAS 62050:2004 pdf download Board level drop test method of components for handheld electronic products
Scope
The Board Level Drop Test Method is intended to evaluate and compare drop performance of surfacemount electronic components for handheld electronic product applications in an accelerated testenvironment, where excessive flexure of a circuit board causes product failure, The purpose is tostandardize the test board and test methodology to provide a reproducible assessment of the drop testperformance of surface mounted components while duplicating the failure modes normally observedduring product level test.
The purpose of this document is to prescribe a standardized test method and reporting procedure. This isnot a component qualification test and is not meant to replace any system level drop test that maybeneeded to qualify a specific handheld electronic product. The standard is not meant to cover the drop testrequired to simulate shipping and handling related shock of electronic components or PCB assembliesThese requirements are already addressed in JESD22-B104-B and JESD22-B110. The method isapplicable to both area-array and perimeter-leaded surface mounted packages.
Correlation between test and field conditions is not yet fully established. Consequently, the testorocedure is presently more appropriate for relative component performance than for use as a pass/facriterion. Rather, results should be used to augment existing data or establish baseline for potentialinvestigative efforts in package/board technologies
The comparability between different test sites, data acquisition methods, and board manufacturers hasnot been fully demonstrated by existing data. As a result, if the data are to be used for direct comparisonof component performance, matching study must first be performed to prove that the data are in factcomparable across different test sites and test conditions
This method is not intended to substitute for full characterization testing, which might incorporatesubstantially larger sample sizes and increased number of drops. Due to limited sample size and numberof drops specified herc, it is possible that enough failure data may not be generated in every case toperform full statistical analysis.
2 Apparatus
As per JESD22-B104-B and JESDD22-B110
3 Terms and definitions
For purposes of this standard, the following definitions shall apply
component: A packaged semiconductor device.
single-sided PCB assembly: A printed circuit board assembly with components mounted on only oneside of the board
double-sided PCB assembly: A printed circuit board assembly with components mounted on top andbottom sides of the board.
handheld electronic product: A product that can conveniently be stored in a pocket (of sufficient size)and used when held in user’s hand.
NOTEIncluded in handheld electronic products are cameras, calculators, cell phones, pagers, palm-size PCs(formerly called ‘pocket organizers), Personal Computer Memory Card International Association (PCMCIA) cardssmart cards, mobile phones, personal digital assistants (PDAs), and other communication devices.
peak acceleration: The maximum acceleration during the dynamic motion of the test apparatus
pulse duration; acceleration interval: The time interval between the instant when the acceleration firstreaches 10% of its specified peak level and the instant when the acceleration first returns to 10% of thespecified peak level after having reach that peak level.
table drop height: The free-fall drop height of the drop table needed to attain the prescribed peakacceleration and pulse duration.
event: An electrical discontinuity of resistance greater than 1000 ohms lasting for 1 microsecond orlonger.
event detector: A continuity test instrument capable of detecting electrical discontinuity of resistancegreater than 1000 ohms lasting for I microsecond or longer.
4Applicable documents
JESD22-B104-BMechanical Shock
IESD22-B110.Subassembly Mechanical Shock
IPC-SMT-782, Surface Mount Design and Land Pattern Standard
IPC-A-600,Acceptabiliry of Printed Boards
J-STD-020. Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount
Devices
I-STD-033, Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive SurfaceMount Devices
IPC-9701, Performance Test Methods and Oualification Requirements for Surface Mount Solder
Aftachments

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