BS/EN 61189-5-1-2016 pdf download.Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-1: General test methods for materials and assemblies — Guidance for printed board assemblies.
8.11 Guidelines for Cleaning of Printed Boards and Assemblies (IPC-CH-65A)
This manual is a road map for current and developing cleaning issues, rather than to function as a highly detailed document for all areas touched upon. In areas of cleaning where recent detailed IPC manuals already exist, the relevant sections in IPC-CH-65A will contain only sufficient information to make the reader reasonably knowledgeable. This guideline manual refers the reader to appropriate existing IPC documents (where they exist) for in-depth Information on the particular subject. An example of such a reference IPC manual is IPC-AC62, Aqueous Cleaning Handbook. It is only where existing IPC documents are not available that IPC-CH-65A will expand information beyond the basics in order to cover what is currently known about the subject. A benefit of this approach is that the manual does not become unwieldy and tends to foster a user-friendly environment.
Both bare board fabrication and assembly cleanliness issues are addressed. The fabrication and assembly sections are separated for ease of access. In the original IPC-CH-65, these sections were very much intertwined. However, it was recognized that for a subject such as the required cleanliness of finished bare boards, basically redundant teachings are required for both the fabrication and assembly sections.
8.12 Handbook (IPC-J-STD-005)
This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface-mount technology (SMT) processes. This document also suggests some test methods that can help with designing and testing solder pastes. It is intended for use by both vendors and users of solder paste.
Solder pastes are unique materials, whose performance in a surface-mount process depends on a variety of variables, many of them interacting. J-STD-005 provides test methods for classification of solder paste based on the use of a variety of testing techniques. However, these solder paste classifications do not have a direct correlation to identify the type and characteristics of a specific solder paste that is needed in any given SMT assembly process.
This document has been written as a guide to assess the applicability of a solder paste for a specific process, given the tremendous number of permutations of different materials, atmospheres and process variables currently available.
Where appropriate, references are given to papers and documents with further information. Due to the sheer number of possible interacting factors, specific solder paste selection criteria cannot be given. The solder paste selected and the assembly process used will need to form solder connections that meet the requirements of industry standards such as J-STD-OO1 and/or IPC-A-610.
Conformal coatings are used in conjunction with printed circuit assemblies (PCAs). The designer and the users of conformal coatings for electronics applications should be aware of the properties of various types of conformal coatings and their interactions with PCAs to protect the PCAs in the end-use environment for the design-life of the PCA (or beyond). This document has been written to assist the designers and users of conformal coatings in understanding the characteristics of various coating types, as well as the factors that can modify those properties when the coatings are applied. Understanding and accounting for these materials can ensure the reliability and function of electronics.
The purpose of this handbook is to assist the individuals who either make choices regarding conformal coating or who work in coating operations. This handbook represents the compiled knowledge and experience of the IPC Conformal Coating Handbook Task Group. It is not enough to understand the properties of the various conformal coatings. The user needs to understand what is to be achieved by applying the conformal coating and how to verify that the desired results have been realized.
B.15 Solder mask Handbook (IPC-HDBK-840)
Solder masks are permanent protective coatings that perform a number of functions during the fabrication, assembly and end use of printed circuits. One of the main purposes of solder mask is to protect the circuitry from interacting with solder during the assembly process. A solder masks job isn’t solely restricted to the solder operation however, as it also helps to protect the laminate, holes and traces from collecting contaminants and from degrading during the service life of the circuit. It also acts as an insulator of known dielectric property between components and traces.
The main requirements of the solder mask (as a material qualification) are tested within the IPC-SM-840. However, increasing technical diversification created further testing needs. Not every technical requirement is relevant for every application and thus these requirements will not be part of a general material qualification. These properties are usually required for specific original equipment manufacturer’s (OEM) approvals. This solder mask handbook provides the reader with the background knowledge to make an educated decision if specific properties are required and how to test them, It also provides significant educational information about process influences.
The purpose of this handbook is to provide additional supporting information for IPC-SM-840 regarding solder mask types, processes, characteristics and properties in order to assist with the correct selection and use of the most appropriate material for the intended application. It should be read in conjunction with the solder mask manufacturer’s technical information and other solder mask specification documents, which may be relevant, such as those listed in Section 2 of IPC-HDBK-840.BS/EN 61189-5-1-2016 pdf download.
BS/EN 61189-5-1-2016 pdf download
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