BS/EN 60317-20-2014 pdf download.Specifications for particular types of winding wires Part 20: Solderable polyurethane enamelled round copper wire, class 155.
This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a sole coating based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements.
NOTE A modified resin is a resin that has undergone a chemical change, or contains one Of more additives to enhance certain performance or application characteristics.
The range of nominal conductor diameters covered by this standard is:
— Grade 1: 0,018 mm up to and including 0.800 mm:
— Grade 2: 0,020 mm up to and including 0.800 mm.
The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies, For undated references, the latest edition of the referenced document (including any amendments) applies.
IEC 60317-0-1:2013, Specifications for particular types of winding wires — Part 0-1: General requirements — Enamelled round copper wire
3 Terms, definitions, general notes and appearance
3.1 Terms and definitions
Subclause 3.1 of IEC 60317-0-1:2013 applies.
3.2 General notes
3.2.1 Methods of test
Subclause 3.2.1 of IEC 60317-0-1:2013 applies. In case of inconsistencies between IEC 60317-0-1:2013 and this part of IEC 60317, the latter shall prevail.
3.2.2 Winding wire
Class 155 is a thermal class that requires a minimum temperature index of 155 and a heat shock temperature of at least 175 °C.
4 Dimensions
Clause 4 of IEC 60317-0-1:2013 applies.
5 Electrical resistance
Clause 5 of IEC 60317-0-1:2013 applies.
6 Elongation
Clause 6 of IEC 60317-0-1:2013 applies.
7 Springiness
Clause 7 of IEC 60317-0-1:2013 applies.
8 Flexibility and adherence
Clause 8 of IEC 60317-0-1:2013 applies.
9 Heat shock
Clause 9 of (EC 60317-0-1:2013 applies. The minimum heat shock temperature shall be 175 °C.
10 Cut-through
No failure shall occur within 2 mm at 200 °C.
11 Resistance to abrasion (nominal conductor diameters from 0,250 mm up to
and including 0,800 mm)
The wire shall meet the requirements given in Table 1.
For intermediate nominal conductor diameters, the value of the next larger nominal conductor diameter shall be taken.
12 Resistance to solvents
Clause 12 of IEC 60317-0-1:2013 applIes.
13 Breakdown voltage
Clause 13 of IEC 60317-0-1:2013 applies. The elevated temperature shall be 155 C.
14 Continuity of insulation
Clause 14 of IEC 60317-0-1:2013 applies.
15 Temperature index
Clause 15 of IEC 60317-0-1:2013 applIes. The minimum temperature index shall be 155.
16 Resistance to refrigerants
Test inappropriate.
17 Solderability
17.1 Nominal conductor diameters up to and Including 0,100 mm
The temperature of the solder bath shall be (390 ± 5) C. The maximum immersion time shall be 2 s.
18 Heat or solvent bonding Test inappropriate.
19 DielectrIc dissipation factor Test to be agreed between purchaser and supplier.
20 Resistance to transformer oil Test inappropriate.
21 Loss of mass
Test inappropriate.
23 PIn hole test
Clause 23 of IEC 60317-0-1:20 13 applies.
30 Packaging
Clause 30 of IEC 60317-0-1:2013 applies.BS/EN 60317-20-2014 pdf download.
BS/EN 60317-20-2014 pdf download
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