BS EN 205:2016 pdf download.Adhesives – Wood adhesives for non-structural applications Determination of tensile shear strength of lap joints.
BS EN 205 specifies tests for adhesives for wood and derived timber products for the assessment of their resistance to hot and cold water. It can be used for the assessment of the strength of bonds with a thin bond-line. It does not apply to adhesives for structural use or to the manufacture of particleboards, fibreboards and plywood. It does not replace tests on finished products.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (Including any amendments) applies.
EN 204, Classification of thermoplastic wood adhesives for non-structural applications
EN 923, Adhesives- Terms and definitions
EN 12765, Classification of thermosetting wood adhesives for non-structural applications
ISO 5893, Rubber and plastics test equipment — Tensile, fiexural and compression types (constant rate of traverse) — Specification
ISO 6344-2:1998, Coated abrasives — Grain size analysis — Part 2: Determination of grain size distribution ofmacrogrits P12 to P220
3 Terms and definitions
For the purposes of this document, the terms and defInitions given in EN 923 and the following apply.
3.1
thin bond line
close contact adhesive joint where the adhesive layer is nominally 0,1 mm thick
4 Principle
A symmetrical bonded single lap joint between two symmetrical wooden adherends is subjected to
specified conditioning treatments and strained to rupture by a tensile force parallel to the grain.
5 Apparatus
The testing machine shall be a constant-rate-of-traverse machine as described in ISO 5893. If a constant-rate-of-traverse machine is not available, a constant-rate-of-loading machine shall be used causing a rupture within the time limits specified in 6.5.
6 Procedure
6.1 Preparation of bonded assemblies
Prepare two panels (see Figure 1) from a thick unsteamed, conditioned, straight-grained board of beech (Fagus sylvatica L) with a nominal density of (700土50) kg/m3 with a moisture content of(12土1) %.
It is permissible to prepare panels from different boards unless it is essential to minimize differences in the wood in order to conduct special comparative tests.
Ensure that the angle between the growth rings and the surface to be bonded is between 30° and 90°.
Cut the panels across the direction of the grain to a length equal to a multiple of 300 mm with the necessary allowance for cross-cutting and along the grain to a width of approximately 130mm making an allowance for the width of cut as shown in Figure 1.
For tests use two panels of (5,0 i 0,1) mm thickness.
For conventional tests, condition the panels at a temperature of either (20 ± 2) °C and (65 ± 5) % relative humidity or (23 ± 2) °C and (50 ± 5) % relative humidity subsequently referred to as the standard atmosphere (20/65) or (23/50) for a minimum of 7 days.
Prepare bonded assemblies using thin (approximately 0,1 mm) bond-lines. Not more than 24 h before bonding, either lightly plane or lightly sand each surface to be bonded (using an abrasive paper of grain size P100 complying with Iso 6344-2:1998 is recommended). Remove any dust carefully. Do not touch or soil the prepared surfaces.
Comply with the adhesive manufacturer’s instructions regarding the processing conditions, including the preparation of the adhesive, the amount of adhesive to be applied, whether the adhesive is to be applied on one or both surfaces, the open and closed assembly time and the magnitude and duration of the assembly pressure and report them in the test report.
Where no manufacturer’s instructions are available the following processing conditions shall be used:
— adhesive applied on both sides;
— adhesive spread: (150 ± 10) g/m2
— open assembly time: (120 ± 10) s;
— closed assembly time (180 ± 10) s;
— pressing pressure (0,7 ± 0,1) N/mm2
— pressing time: 2 h;
Bond the two 5 mm thick panels as shown in Figure 1 with the pressure uniformly distributed over the bonded surface.BS EN 205 pdf free download.
BS EN 205:2016 pdf download
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