BS EN 62047-4-2010 pdf download BS Standards

BS EN 62047-4-2010 pdf download

BS EN 62047-4-2010 pdf download.Semiconductor devices Micro-electromechanica devices Part 4 : Generic specification for MEMS. These subgroups may not all be required. The required subgroups are specified in the relevant sectional or blank detail specification. 6.2.3.3 Inspection...
08-08
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BS EN 62047-8-2011 pdf download BS Standards

BS EN 62047-8-2011 pdf download

BS EN 62047-8-2011 pdf download.Semiconductor devices Micro-electromechanical devices Part 8: Strip bending test method for tensile property measurement of thin films. It is recommended to perform a test under constant temperature and humidity. Temperature change can induce...
08-07
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EN 62047-13-2012 pdf download EN Standards

EN 62047-13-2012 pdf download

EN 62047-13-2012 pdf download.Semiconductor devices -Micro-electromechanical devices -Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures. 4.1 General This standard specifies the adhesive testing methods between a columnar test piece (see...
07-10
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