AIA/NAS 4122-2013 pdf download HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, EXTRUDED
MATERIAL:
FINISH:
ALUMINUM ALLOY EXTRUSION,6063-T5 (UNS A96063), PER QQ-A-200/9ASTM B241/B241M.
ASTM B221OR ASME SB-221.
BLACK ANODIZE COATING CONFORMING TO TYPE I OR TYPE II OF MIL-A-8625.INSULATING COATING (ELECTRICAL INSULATION UP TO 500 V dc).HARD ANODIZE COATING CONFORMING TO TYPE II OF MIL-A-8625. THIS FINISH SHALL HAVE AMINIMUM THICKNESS OF .001 INCH HARD ANODIZE COATING AND SHALL BE SODIUMDICHROMATE SEALED.THROUGH-HOLES,SHARP EDGESAND THREADS MAY BE FURNISHEDFREE OF ANODIZEBUT IN SUCH CASES THESE SURFACES SHALL RECEIVE A CHEMICALCONVERSION COATING IN ACCORDANCE WITH MIL-DTL-5541 CLASS 3.THIS FINISHTYPICALLY PROVIDES 200 V dc PUNCTURE RESISTANCE PER FILM COATGOLD CHROMATE IN ACCORDANCE WITH MIL-DTL-5541,CLASS 3
CODE:
FINISH CODES SHALL BE AS FOLLOWS:
“B” – BLACK ANODIZE COATING
“D” – INSULATING COATING (ELECTRICAL INSULATION UP TO 500 V dc)
“L” – HARD ANODIZE COATING
“M” – GOLD CHROMATE
NO CODE – NO FINISH
EXAMPLE OF PART NUMBER:
NAS41 22-01 B = EXTRUDED HEAT SINK MADE OF ALUMINUM ALLOY WITH BLACK ANODIZE FINISH
FINISH CODE
DASH NUMBER
BASIC PART NUMBER
NOTES:
(1 ) DIMENSIONS IN INCHES AND APPLY AFTER FINISH UNLESS OTHERWISE SPECIFIED.
2) TOLERANCES ON CONFIGURATION DIMENSIONS (FIGURE 1 ) UNLESS OTHERWISE SPECIFIED: DECIMALS ± .01 1 . A .062 RADIUS IS PERMITTED ON CORNERS AND EDGES. CUTOFF TOLERANCE SHALL BE ± .022, UNLESS OTHERWISE INDICATED.
(3) TOLERANCES ON MOUNTING HOLE DIMENSIONS (FIGURE 2) UNLESS OTHERWISE SPECIFIED: DECIMALS ± .01 0; ANGLES ± 2°.
(4) CONFIGURATION DIAGRAMS DEPICT GENERAL DESIGN CHARACTERISTICS. SHAPE OF ACTUAL PARTS MAY VARY SLIGHTLY WITHIN THE ENVELOPE DIMENSIONS SHOWN, PROVIDED THAT ALL THERMAL CHARACTERISTICS ARE MET.
(5) MOUNTING SURFACE FLATNESS: THE MAXIMUM ALLOWABLE DEVIATION FROM FLAT ON SEMICONDUCTOR MOUNTING SURFACES IS .004 INCHES PER INCH FULL INDICATOR MOVEMENT (FIM).
(6) SURFACE ROUGHNESS: MOUNTING SURFACE ROUGHNESS SHALL NOT EXCEED 63 MICROINCHES Ra PER ASME B46.1 .
(7) JEDEC CASE SIZES: SEE FIGURE 2. THE ABBREVIATION JEDEC REFERS TO THE JOINT ELECTRON DEVICE ENGINEERING COUNCIL, WHICH IS THE SEMICONDUCTOR ENGINEERING FUNCTION OF THE ELECTRONIC INDUSTRIES ASSOCIATION.

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